onsemi unveils Embedded Power Platform to boost power density

onsemi has unveiled its Embedded Power Platform (EPP), a new architecture that utilizes the silicon wafer itself as the package to integrate electrical, mechanical, and thermal designs. By embedding heterogeneous power dies—such as FETs, drivers, and controllers—directly into the silicon and connecting them via wafer-level redistribution layers instead of traditional wire bonds, the platform aims to overcome the limitations of separate component optimization.

The EPP is designed to address increasing power density requirements in AI data centers, electric vehicles (EVs), and industrial automation. According to onsemi, the platform can achieve 3 to 5 times higher power density depending on the application. In AI infrastructure, early designs for solid-state circuit breakers showed a 50% reduction in size and a 20% decrease in temperature. For EV traction inverters, the technology aims to provide up to 4 times higher power density and a 15% reduction in power loss.

Subaru Corporation has joined as an early strategic technology partner, evaluating the platform for use in future electrified vehicle architectures. onsemi plans to begin supplying samples to strategic customers and ecosystem partners in the automotive and AI sectors starting in 2026.