onsemi unveils Embedded Power Platform for high-density semiconductors

onsemi has announced the ‘Embedded Power Platform’ (EPP), a new architecture that utilizes silicon wafers as a package base to integrate power system designs. By embedding semiconductor chips—such as silicon, silicon carbide (SiC), and gallium nitride (GaN)—directly into a 12-inch wafer and connecting them via a wafer-level redistribution layer, the technology allows for the simultaneous optimization of electrical, mechanical, and thermal designs.

Key benefits of the EPP include a 3 to 5-fold increase in power density and the potential to reduce development cycles to as little as four months. The architecture reduces parasitic inductance, which helps minimize power loss and noise while improving thermal performance. In practical applications, onsemi reported that AI infrastructure circuit breakers were 50% smaller with a 20% temperature reduction, while electric vehicle traction inverters achieved up to 4 times the power density with a 15% reduction in power loss.

Subaru has already agreed to a strategic technical collaboration with onsemi to evaluate this power architecture for next-generation electric vehicles. onsemi plans to begin providing samples to strategic customers and partners in the automotive and AI sectors during 2026.