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PlayStation 5 hardware faces overheating due to cooling system corrosion
Early batches of the Sony PlayStation 5, specifically the CFI-1116 series released in late 2020, are experiencing severe internal component wear due to corrosion in the cooling system.
Technical tests released on August 13, 2026, revealed that the gallium-based liquid metal alloy used as a thermal compound is reacting with the hardware. Hardware specialist Modyfikator89 reported that the nickel protective layer on the copper heatsink base has completely disappeared in some units. This allows the gallium to penetrate and dissolve the copper, creating physical damage and contact failures. These issues result in temperature spikes and sudden shutdowns that can potentially render the consoles unusable.
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Claims
What the coverage asserts, and how many sources carry each claim.
- [○ 1 SOURCE] Technical tests released on August 13, 2026, confirmed that the thermal compound used in early PlayStation 5 units causes component degradation. www.mixvale.com.br
- [○ 1 SOURCE] Direct interaction between gallium and copper creates contact failures and dry areas that block heat transfer. www.mixvale.com.br
- [○ 1 SOURCE] Hardware specialist Modyfikator89 discovered corrosion in the cooling block of a CFI-1116 series PlayStation 5. www.mixvale.com.br
- [○ 1 SOURCE] The gallium-based liquid metal alloy used for cooling is corroding the nickel protective layer on the copper heatsink. www.mixvale.com.br