Porsche to introduce GaN semiconductor technology in audio systems by 2027

Porsche has announced plans to integrate gallium nitride (GaN) semiconductors into its Burmester 3D High-End Surround Sound System starting in 2027. Developed in collaboration with the University of Stuttgart, this technology is expected to be the first of its kind ready for mass production in the automotive audio sector.

The GaN-based chip will handle voltage conversion for a 400-watt subwoofer amplifier. Compared to traditional silicon components, GaN allows for higher switching frequencies and lower energy losses. This increased efficiency results in less heat generation, which in turn reduces the need for cooling. Consequently, the amplifier's heat sink can be approximately 20% lighter, and passive components such as capacitors and inductors can be smaller, allowing for a more compact and lightweight design.

While Porsche has not specified which vehicle model will first feature this system, the company is also exploring further applications for GaN in high-voltage systems. The reduction in aluminum used for heat sinks also offers environmental benefits by lowering CO2 emissions associated with metal production.