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Samsung and Broadcom expand AI semiconductor collaboration
Samsung Electronics and Broadcom have signed a memorandum of understanding to expand their strategic collaboration in memory and foundry technologies to support next-generation AI infrastructure. The announcement was made at the AI Summit held at The Midway in San Francisco.
The two companies project that the scale of their collaboration in the memory and foundry sectors will exceed $200 billion over the next five years, through 2030. In the memory sector, the partnership focuses on supplying high-bandwidth memory (HBM) and other advanced solutions for Broadcom's next-generation AI accelerator chips.
In the foundry sector, the collaboration will utilize Samsung's advanced process technology of 2 nanometers (nm) or less for Broadcom products, including wireless broadband communication (WBC) solutions. The scope of work also extends to advanced packaging technologies, such as 2.5D and 3D integration based on Samsung's 2nm process, aimed at creating high-performance, low-power semiconductors for AI and networking applications.
Entities
Broadcom · Hock Tan · Jinman Han · Samsung Electronics · Young Hyun Jun
Claims
What the coverage asserts, and how many sources carry each claim.
- [● 3 SOURCES] The collaboration will include advanced packaging technologies, such as 3D and 2.5D integration based on Samsung's 2nm process, to achieve high-performance, low-power AI and networking semiconductors. www.the-miyanichi.co.jp · k-tai.watch.impress.co.jp · prtimes.jp
- [● 3 SOURCES] Samsung plans to supply high bandwidth memory (HBM) and other industry-leading memory solutions for Broadcom's next-generation AI accelerator chips. www.the-miyanichi.co.jp · k-tai.watch.impress.co.jp · prtimes.jp
- [● 3 SOURCES] In the foundry sector, the companies will collaborate using Samsung's 2nm or smaller process technology for Broadcom products, including wireless broadband communication solutions. www.the-miyanichi.co.jp · k-tai.watch.impress.co.jp · prtimes.jp
- [● 3 SOURCES] The companies expect the scale of collaboration in memory and foundry fields to exceed $200 billion over the next five years leading up to 2030. www.the-miyanichi.co.jp · k-tai.watch.impress.co.jp · prtimes.jp
- [● 3 SOURCES] Samsung and Broadcom signed a memorandum of understanding to expand strategic collaboration in memory and foundry technologies. www.the-miyanichi.co.jp · k-tai.watch.impress.co.jp · prtimes.jp