Samsung and LG showcase next-generation AI semiconductor substrates

At the KPCA SHOW 2026 in Incheon, South Korean technology leaders Samsung Electro-Mechanics, LG Innotek, and Famtech showcased advanced semiconductor packaging and substrate technologies designed for AI accelerators.

Samsung Electro-Mechanics presented several next-generation products, including 2.5D and 2.1D package substrates, glass substrates, and automotive FC-BGA. Their 2.5D technology focuses on reducing warping in large-area, high-layer substrates, while their 2.1D substrates allow direct chip-to-chip connection without a silicon interposer. The company is currently operating a glass substrate pilot line with plans for full-scale production by 2028.

LG Innotek introduced its high-performance Flip Chip Ball Grid Array (FC-BGA) for AI accelerators, featuring large-area substrates exceeding 100mm. The company also demonstrated chip embedding technology, which places chips inside the substrate to minimize connection distances and reduce power loss. LG Innotek aims for mass production of these technologies by 2028.

Additionally, Famtech expanded its semiconductor equipment portfolio by unveiling a glass substrate handling robot/system for Panel Level Packaging (PLP) and a portable Peltier-based temperature control system for testing electronic components.