Samsung and OpenAI expand AI semiconductor cooperation

Samsung Electronics is hosting the ‘Samsung AI Forum 2026’ in Seoul, featuring Richard Ho, Vice President and Head of Hardware at OpenAI, as a keynote speaker. Ho, who previously played a key role in developing Google’s TPU, will discuss the evolution from chatbots to ‘agentic workflows’ and the computing infrastructure required for AI agents.

The forum highlights the deepening partnership between Samsung and OpenAI. Following a letter of intent signed last October, Samsung is expected to supply its sixth-generation high-bandwidth memory (HBM4) to OpenAI’s ‘Jalapeño’ AI inference chip project. Industry observers are also watching for potential expansion of their cooperation into the foundry sector, especially given Broadcom’s existing strategic partnership with Samsung.

Separately, major South Korean tech firms are intensifying efforts to secure AI talent. Samsung Electronics held a ‘2026 Tech Forum’ in Silicon Valley to discuss the convergence of AI and robotics. Meanwhile, LG has launched various initiatives, including the ‘LG Aimers Hackathon’ focused on predictive AI models and the ‘Optimization Grand Challenge 2026’ hosted by LG CNS to solve complex industrial problems through mathematical optimization.