Samsung and Texas Instruments reveal AI infrastructure solutions at OCP Summit

At the Open Compute Project (OCP) Global Summit in California, Samsung Electronics and Texas Instruments unveiled new technologies designed to support the growing demands of AI workloads and data center infrastructure.

Samsung Electronics introduced a three-part strategy for next-generation memory focused on speed, scalability, and persistence. To address increasing data processing needs, the company is developing 8th-generation High Bandwidth Memory (HBM5), custom HBM, and Processing-in-Memory (PIM) to improve computational efficiency. Samsung also showcased its collaboration with NVIDIA, displaying Grok wafers and Grok 3 LPX systems produced via its 4nm foundry process, and demonstrated CXL-based memory expansion solutions alongside AMD.

Texas Instruments (TI) presented solutions to mitigate risks such as power instability and downtime in AI data centers. These include the ADC34DSO75, an analog-to-digital converter providing nanosecond-resolution remote monitoring to detect transient voltage fluctuations. TI also introduced the LMI800PS, an 800V isolated hot-swap controller designed to reduce board space by over 60%, and the LMK6B oscillator, which utilizes Bulk Acoustic Wave (BAW) technology to provide high-precision timing for high-speed data transmission.