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[TECHNOLOGY] · South Korea, United States · 23 sources

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Samsung unveils AI memory and 6G network strategies

Samsung Electronics has unveiled a comprehensive roadmap for next-generation AI infrastructure at the 2026 OCP Global Summit and the Silicon Valley Future Wireless Summit. The company’s strategy focuses on three pillars: high-performance memory, such as HBM5 and customized high-bandwidth memory; memory scalability via Compute Express Link (CXL), including a joint demonstration with AMD; and data persistence through next-generation enterprise SSDs, including a 256TB high-density QLC model. Samsung also introduced V10 NAND, featuring over 400 layers, to enhance data density and efficiency.

In the telecommunications sector, Samsung is presenting a blueprint for AI-native 6G networks. During events in Mountain View, California, the company demonstrated key 6G technologies including AI RAN, X-MIMO, and Communication-Sensing Integration (ISAC). These advancements aim to evolve networks into intelligent, software-driven infrastructures capable of supporting satellite-based 6G coverage and hyper-connectivity between physical and virtual worlds.

Separately, SK hynix reported record-breaking financial results driven by surging demand for High Bandwidth Memory (HBM) in the AI sector. The company’s operating profit reached 60.5 trillion KRW, highlighting the critical role of the semiconductor industry in the broader economy, though analysts note the importance of ensuring these gains benefit the wider industrial ecosystem and local economies.

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COEX · Dongdaemun Design Plaza · Gwanak S-Valley · Incheon Paradise City · Italy · Korea Electronics Show (KES 2026) · LG Electronics · LG Innotek · La Liste · Mauro Porcini · Ministry of Trade, Industry and Energy · Samsung Electronics

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