Samsung Exynos 2700 Chip Chosen for Galaxy S27 Line Outside North America

Samsung plans to equip the forthcoming Galaxy S27 Pro, S27, and S27+ smartphones with its in‑house Exynos 2700 processor in most global markets, including Europe, Asia, Australia, Africa and Latin America. Devices sold in the United States, Canada and Mexico will instead ship with a Qualcomm Snapdragon chip, making the processor version dependent on the buyer’s location.

The Exynos 2700, built on Samsung’s 2‑nanometre process at the company’s Foundry, introduces a side‑by‑side (SBS) package that places the RAM module next to the system‑on‑chip rather than stacked on top. This layout is intended to spread heat more effectively across the CPU, GPU and NPU, reducing thermal throttling and improving sustained performance, especially during intensive gaming, AI tasks and computational photography. Samsung also highlights a new heat‑dissipating material called Heat Path Block used in the chip’s packaging.