TSMC to Raise Chip Production Prices by Up to 10% in 2027

Taiwan Semiconductor Manufacturing Co. (TSMC) is planning its first price adjustment in a year, raising wafer‑fab service fees by 5 % to 10 % for both advanced nodes (7 nm and below) and mature processes (12 nm, 16 nm, 28 nm). The company will add an extra 10 %‑15 % surcharge on high‑performance‑computing (HPC) orders that exceed customers’ original forecasts. The hike, set to take effect at the start of 2027 after negotiations concluded in July, is driven by higher raw‑material costs, more expensive equipment and the capital outlay required for new overseas fabs, including a large Arizona expansion.

Customers affected include Apple, NVIDIA, AMD, Qualcomm, Intel and other major chip designers. The higher manufacturing costs are expected to flow through to end‑user devices such as smartphones, laptops, tablets, AI accelerators, automotive electronics and other consumer products, potentially raising retail prices later in 2027. TSMC stresses that the increase is “strategic, not opportunistic” and notes that it will continue to work closely with clients to manage the impact.