Samsung Galaxy S27 series leaks reveal design and chip changes

Leaks regarding Samsung’s upcoming 2027 Galaxy S27 series suggest significant hardware and design shifts. The lineup may include a new ultra-thin Edge model and a potential Pro variant. Design leaks from third-party cases indicate that while the standard S27 and S27+ may retain a traditional vertical camera layout, the S27 Pro and S27 Ultra could adopt a large, horizontal camera island.

On the performance front, the Exynos 2700 chipset is expected to debut, potentially utilizing Samsung’s 2nm SF2P process. This SoC may feature a unique 10-core CPU architecture with two high-performance C2-Ultra cores and an AMD RDNA 5-based Xclipse 970 GPU. Reports suggest Samsung might employ a dual-chip strategy, using Exynos in certain regions like Europe and South Korea, while reserving Snapdragon processors for the US market.

Other rumored specifications include a possible 200MP main camera for the Ultra model, changes to telephoto zoom capabilities, and varying battery capacities. However, some leaks suggest charging speeds may remain limited to 25W for standard models and 45W for Plus models, consistent with previous generations.