Samsung plans 2029 mass production of 1.4nm chip process to compete with Intel and TSMC

Samsung Electronics is restarting commercialization of its 1.4nm semiconductor process, shifting the target for mass production from 2027 to 2029 to prioritize yield improvements on its 2nm nodes. The move is intended to strengthen Samsung’s foundry position against rivals Intel and TSMC, whose 1.4nm‑class products are slated to enter production earlier. Samsung’s revived 1.4nm line, codenamed SF1.4, will use high‑NA EUV lithography supplied by ASML, with equipment partners such as Applied Materials and Lam Research supporting the effort at the NRD‑K R&D campus. Successful rollout could give Apple an additional supplier option and open new opportunities for other customers. Samsung also announced plans for a next‑generation V12 NAND slated for 2030, featuring over 1,000 layers through advanced stacking technologies.