SanDisk advances 3D Matrix Memory as DDR4 prices rise

SanDisk has manufactured and encapsulated its first test chips for 3D Matrix Memory technology using 300 mm silicon wafers. Developed since 2017, this new class of memory is positioned between DRAM and NAND flash, utilizing a three-dimensional stacked matrix architecture. The company aims for the technology to achieve up to four times the capacity of DRAM while maintaining a cost per bit approximately half that of conventional DRAM. While functional multi-gigabit prototypes exist, the technology is considered a long-term project with no commercial release date yet announced.

Separately, the market for DDR4 memory is experiencing price increases due to a reduction in production by major semiconductor manufacturers. Companies including Samsung, SK Hynix, and Micron are shifting production lines toward more modern standards like DDR5 and High Bandwidth Memory (HBM) to meet the demands of artificial intelligence servers. This shift, combined with high residual demand for budget PC builds and server upgrades, is depleting existing DDR4 inventory and driving up costs for both desktop and laptop modules.