Schneider Electric and AMD unveil AI‑ready Helios reference design

Schneider Electric and AMD announced the first jointly developed reference design for the rack‑scale AMD Helios platform, aimed at simplifying and accelerating the deployment of high‑density AI infrastructure, often called “AI factories”. The design supports up to 10.4 MW of IT load and up to 246 kW per rack, using AMD Instinct MI455X GPUs, sixth‑generation AMD EPYC processors, AMD Pensando Vulcano NICs and the open‑source ROCm software stack.

The solution integrates advanced liquid‑cooling units from Motivair, hybrid air‑water cooling capable of removing up to 84 % of generated heat, and digital‑twin tools such as ETAP, EcoStruxure IT Design CFD and AVEVA Unified Operations Center for design validation and real‑time monitoring. Schneider Electric’s Executive Vice President Manish Kumar said organizations need comprehensive AI‑ready designs to reduce planning time and integration risk, while AMD’s Executive Vice President Forrest Norrod highlighted the need for joint design across compute, networking, power and cooling for next‑generation AI workloads.