SEMICON Taiwan 2026 focuses on advanced packaging for AI

SEMICON Taiwan 2026 concluded its run at Taipei’s Nangang Exhibition Center, recording over 100,000 attendees from 65 countries and 1,300 exhibitors. The event highlighted a strategic industry shift from transistor miniaturization toward advanced packaging and photonics to meet the data demands of AI accelerators.

Global semiconductor manufacturing equipment sales reached $135.1 billion in the trailing period, a 15% year-over-year increase. Projections suggest 300mm fab equipment spending could exceed $150 billion in 2027, driven by AI chip demand. Additionally, assembly and packaging equipment sales hit a record $6 billion in 2025, with continued growth expected in 2026.

Key developments included the launch of the 3DIC Advanced Manufacturing Alliance (3DICAMA) by SEMI, TSMC, and ASE to standardize advanced-packaging collaboration. Technical focus areas included silicon photonics, co-packaged optics (CPO), and the introduction of a new Quantum Technology Zone.