SEMICON Taiwan 2026 to expand summit focus on AI and advanced packaging

SEMICON Taiwan 2026 is scheduled to take place from September 2 to 4 in Taipei. The event features an expanded Master Conference and Global Ecosystem Summit, which has transitioned from a half-day format to a full-day schedule to address the rapid evolution of the semiconductor industry.

The conference will focus on critical topics including advanced packaging, process equipment, key materials, and the deployment of artificial intelligence (AI) technology. Major industry players such as TSMC, MediaTek, ASUS, Acer, and Foxconn are set to participate, sharing advancements in AI applications ranging from cloud computing to automotive and medical sectors.

In addition to the summit, various companies will showcase manufacturing and testing solutions. Kanematsu Corporation, exhibiting alongside NS Technologies, will present equipment such as MOCVD systems, plasma sputtering systems, and various semiconductor testing tools, highlighting innovations in both front-end and back-end processes.