Semiconductor firms showcase AI and high-capacity storage at FMS 2026

At the FMS 2026 (Future of Memory and Storage) summit held in Santa Clara, California, semiconductor companies showcased advancements in storage solutions designed for the growing demands of edge AI and high-capacity data processing.

Kowin Semiconductor presented four major product lines: embedded storage chips, SSDs, DRAM memory modules, and mobile storage. These products are tailored for diverse AI applications, including wearable devices, industrial terminals, edge gateways, and edge computing hosts. Their offerings aim to address the “storage wall” by balancing performance, power consumption, and reliability for local AI model inference.

DapuStor unveiled a high-capacity 512TB PCIe Gen5 QLC NVMe SSD utilizing the EDSFF E2 form factor. This drive is built on their proprietary DP800 controller and 3D eQLC NAND Flash, supporting NVMe 2.0. Additionally, the company showcased the J5060 U.2 QLC model, which allows for flexible configuration between high-performance pSLC and high-capacity QLC zones.