Semiconductor firms unveil AI-focused memory technologies at FMS 2026

At the 2026 Future of Memory and Storage (FMS) conference in Santa Clara, semiconductor companies unveiled new technological roadmaps focused on artificial intelligence and data center infrastructure.

Rambus Inc. reported a 20.4 percent year-over-year revenue increase to 207.4 million USD for its second quarter of 2026. The company also announced a design win with a major US-based Tier 1 hyperscaler for its next-generation High Bandwidth Memory (HBM) IP solutions. Rambus is prioritizing interface technologies such as DDR5, HBM4, and PCIe 7.0 to optimize data throughput in high-performance systems.

SK hynix introduced new tiers in the memory and storage hierarchy designed to maximize xPU performance for AI inference. These include G0.5, a 3D-stacked DRAM tier providing near-SRAM bandwidth, and G1.5, which features High Bandwidth Flash (HBF) with approximately 1TB capacity. SK hynix has also partnered with Sandisk to develop HBF technology to support AI applications.