Shenzhen hosts 5th GMIF2026 Innovation Summit on AI memory

The 5th GMIF2026 Innovation Summit concluded on September 23 in Shenzhen. Co-hosted by the Shenzhen Memory Industry Association (SMIA) and the School of Integrated Circuits at Peking University, the event focused on the theme “The Future Built on AI Memory and Storage.”

The summit gathered a diverse group of industry participants, including memory solution providers, controllers, equipment suppliers, AI infrastructure vendors, and academic institutions. Discussions centered on the evolution of memory and storage technologies necessitated by scaling AI training and inference workloads. Key topics included inference efficiency, enterprise-grade storage, and cloud-edge-device coordination.

Rixin Sun, President of the SMIA, noted that the summit has expanded in scale and influence since its inception in 2019. He stated that future iterations will focus on supply-chain coordination and connecting storage companies with AI compute and end-user application sectors to foster ecosystem collaboration.