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SK Hynix considers Intel Foundry for HBM4E base-die production
SK Hynix is exploring a multi-vendor strategy for its next-generation high-bandwidth memory (HBM) production to diversify its supply chain and manage rising costs. The company is reportedly considering Intel Foundry as an alternative or additional supplier for the base dies of its seventh-generation HBM4E memory, which would challenge TSMC’s current exclusive role in this area. The base die, which acts as the logic layer controlling the interface between memory and processors, has become increasingly complex and expensive, costing an estimated three to four times more than the core DRAM die.
Beyond base-die manufacturing, SK Hynix is evaluating advanced packaging technologies, comparing Intel’s EMIB with TSMC’s CoWoS solutions. The company is also pursuing geographic diversification, including the possibility of establishing a joint venture to produce memory chips in Japan and its ongoing $4 billion investment in an advanced packaging facility in West Lafayette, Indiana.
Amid these strategic shifts, SK Hynix CEO Kwak Noh-jung has warned that the global memory semiconductor shortage, driven by intense AI demand, is expected to persist through 2030. This structural shortage is influencing the entire electronics market, impacting everything from server modules to consumer devices like MacBooks.
Entities
Chey Tae-won · Choi Tae-won · Indiana · Intel · Intel Foundry · Japan · Kwak Noh-jung · Nvidia · SK Hynix · TSMC
Claims
What the coverage asserts, and how many sources carry each claim.
- [● 4 SOURCES] SK Hynix transitioned from internal base die production for HBM3E to outsourcing for HBM4. techfocus24.com · technews.tw · biz.heraldcorp.com · abmedia.io
- [● 7 SOURCES] SK Hynix is considering using Intel Foundry to produce base dies for its seventh-generation HBM4E memory. techfocus24.com · technews.tw · biz.heraldcorp.com · abmedia.io · cryptobriefing.com · +1 more
- [● 4 SOURCES] SK Hynix currently utilizes TSMC’s 12-nanometer-class process for HBM4 base dies. techfocus24.com · technews.tw · biz.heraldcorp.com · abmedia.io
- [● 4 SOURCES] The cost of TSMC’s HBM4 base die is estimated to be three to four times the cost of the core DRAM die. techfocus24.com · technews.tw · biz.heraldcorp.com · abmedia.io
- [● 6 SOURCES] SK Hynix CEO Kwak Noh-jung expects the current memory semiconductor shortage to continue through the end of 2030. boxthislap.org · news.mynavi.jp · swedroid.se · www.kapitalmarktexperten.de · www.dagensps.se · +1 more
- [● 4 SOURCES] SK Hynix is evaluating Intel’s EMIB as an alternative to TSMC’s CoWoS advanced packaging. abmedia.io · cryptobriefing.com · biz.heraldcorp.com · www.profesionalreview.com
- [● 5 SOURCES] SK Hynix has begun construction on an advanced packaging facility in West Lafayette, Indiana, with an investment exceeding $4 billion. cryptobriefing.com · news.mynavi.jp · boxthislap.org · www.kapitalmarktexperten.de · www.dagensps.se
- [● 5 SOURCES] SK Hynix is exploring the possibility of establishing a joint venture to produce memory chips in Japan. www.it-boltwise.de · www.stheadline.com · news.mynavi.jp · www.kapitalmarktexperten.de · www.rbbtoday.com