SK hynix denies finalized plans for U.S. memory chip production with Intel

SK hynix has stated that no specific plans have been finalized regarding memory chip production in the United States, following reports of potential manufacturing agreements with Intel. The company clarified that while it is exploring options to strengthen global competitiveness, no arrangements have been confirmed concerning scenarios such as leasing space at Intel’s Ohio facility or forming a joint venture with Intel and cloud companies.

Separately, SK hynix subsidiary Solidigm is reportedly evaluating the possibility of building a NAND flash memory plant in the U.S., with upstate New York identified as a potential location. This move could help reduce reliance on existing production sites in China and mitigate risks related to trade tariffs and equipment export restrictions. However, the company noted that all options remain under evaluation.

SK hynix is currently expanding its U.S. footprint through a $4 billion advanced packaging facility in West Lafayette, Indiana. This site, which includes high-bandwidth memory (HBM) production lines, is expected to begin mass production of next-generation HBM in 2029.