SK hynix plans mass production of iHBM cooling technology

SK hynix has begun discussions with domestic and international suppliers regarding the mass production of its iHBM thermal management technology. This innovation, which the company claims can reduce thermal resistance by 30%, is intended for next-generation HBM5 products targeted at high-performance computing and AI data centers.

The iHBM technology utilizes an Integrated Cooling Element (ICE) made of non-conductive, highly thermally conductive silicon-based material. This element is placed directly in the heat-intensive D2D PHY area of the HBM package, creating a dedicated thermal path that bypasses the stacked DRAM layers to reach the cooling plate more efficiently.

While SK hynix is moving toward production, the technology is expected to be part of the HBM5 roadmap, with products potentially arriving around 2029. The company is currently using TSMC’s CoWoS technology to validate HBM5. This push for thermal efficiency comes as competition intensifies; Samsung Electronics has seen its estimated HBM revenue share rise to 33% in the second quarter, narrowing the gap with SK hynix, which holds a 50% share.