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AI Memory Innovations Unveiled at FMS 2026 Conference
At the Future of Memory and Storage (FMS) 2026 conference in Santa Clara, California, leading semiconductor companies announced a range of new memory technologies aimed at AI workloads.
Samsung Electronics showcased its V10 BV‑NAND prototype with more than 400 stacked layers, delivering about a 58 % increase in storage density over the previous V9 generation. The company also presented concept models of its zHBM and zNAND‑O architectures, claiming zHBM can achieve up to eight times the performance of HBM5, three times the energy efficiency, and more than a 50 % reduction in thermal resistance, while wafer‑bonding could enable over ten‑fold memory density versus conventional HBM5.
SK Hynix and SanDisk jointly released the first open specification for High‑Bandwidth Flash (HBF), supporting up to 512 GB per stack and bandwidth up to 3 TB/s, using 8‑ or 16‑layer NAND stacks to bridge the gap between high‑bandwidth memory and SSDs.
KIOXIA introduced the GP1 Series PCIe 6.0 NVMe SSDs, capable of up to 10 million random‑read IOPS, and announced the XL1 memory‑expansion module that pairs its XL‑FLASH with a CXL interface to supplement DRAM in AI systems.
Marvell Technology expanded its AI memory‑infrastructure portfolio with the Bravera SC6 PCIe 6.0 SSD controller (twice the performance of the prior generation), the Structera X CXL memory‑expansion platform, and a Photonic Fabric architecture that can share up to 32 TB of warm KV cache across distances of up to 50 m.
Entities
BV‑NAND (V10 Bonding V‑NAND) · Bank of America · Future of Memory and Storage (FMS) 2026 · Future of Memory and Storage (FMS) conference · Future of Memory and Storage conference · Kioxia · Marvell Technology · Micron Technology, Inc. · Rosenblatt Securities · SK Hynix · SK Hynix Co., Ltd. · Samsung Electronics
Claims
What the coverage asserts, and how many sources carry each claim.
- [○ 1 SOURCE] SK Hynix controls roughly 58% of the high‑bandwidth memory market.
- [● 8 SOURCES] Long‑term AI memory agreements could eventually account for 60‑70% of Samsung's memory sales. mix929.com · wkzo.com · www.cnnbrasil.com.br · wsau.com · www.news20.ro · +3 more
- [● 8 SOURCES] Samsung's wafer‑bonding technology could enable more than 10 times the memory density of conventional HBM5. mix929.com · wkzo.com · www.cnnbrasil.com.br · wsau.com · www.news20.ro · +3 more
- [● 13 SOURCES] BV‑NAND increases memory density by about 58% from its previous V9 NAND. mix929.com · wkzo.com · wsau.com · www.cnnbrasil.com.br · www.news20.ro · +7 more
- [● 2 SOURCES] SK Hynix and SanDisk released the first open specification for High‑Bandwidth Flash (HBF) that supports up to 512 GB per stack and bandwidth up to 3 TB/s. meeco.kr · hothardware.com
- [● 14 SOURCES] zHBM can deliver up to eight times the performance and three times the power efficiency of HBM5. mix929.com · www.cnnbrasil.com.br · wkzo.com · wsau.com · www.news20.ro · +7 more
- [● 2 SOURCES] HBF uses stacked 8‑ or 16‑layer NAND die to bridge between HBM and SSD, aiming to alleviate AI inference bottlenecks. meeco.kr · hothardware.com
- [● 4 SOURCES] Samsung Electronics introduced a V10 Bonding V‑NAND (BV‑NAND) prototype with more than 400 layers at the FMS 2026 conference. mix929.com · wkzo.com · wsau.com · www.cnnbrasil.com.br
- [● 10 SOURCES] The announcements were made at the Future of Memory and Storage (FMS) 2026 conference in Santa Clara, California. www.cnnbrasil.com.br · meeco.kr · mix929.com · socialvalue.kr · hothardware.com · +4 more
- [● 3 SOURCES] HBF is intended to bridge the capacity and bandwidth gap between high‑bandwidth memory (HBM) and SSDs for AI inference workloads. meeco.kr · hothardware.com
- [● 4 SOURCES] SK Hynix and SanDisk released the first open specification for High‑Bandwidth Flash (HBF) supporting up to 512 GB per stack and up to 3 TB/s bandwidth. meeco.kr · hothardware.com
- [● 9 SOURCES] Samsung introduced a V10 Bonding V‑NAND prototype with more than 400 stacked layers. www.cnnbrasil.com.br · mix929.com · wkzo.com · wsau.com · www.news20.ro · +4 more