Sony patents water‑based cooling system for next‑gen PlayStation 6

Sony has filed a patent describing a new thermal solution for the upcoming PlayStation 6 that abandons the liquid‑metal interface used in the PlayStation 5. The proposed design uses conical heat‑pipe sections filled with a sealed liquid—likely water—that dissipates heat through vaporisation. The geometry of the pipes creates reservoirs that adjust the liquid level according to the console’s orientation, ensuring consistent cooling whether the unit is held vertically or horizontally.

The patent, accessed via the World Intellectual Property Organization database and reported by gaming outlets, aims to eliminate the risk of liquid‑metal migration that can cause uneven contact, overheating or short‑circuiting in current models. While the filing shows Sony’s engineering direction, it does not guarantee that the technology will appear in the final product, which is still expected to launch several years later.