Sony's PS6 cooling patent plans to replace liquid metal with sealed vapor system

Sony Interactive Entertainment filed a patent in early 2026, published in April, for a cooling system designed for electronic devices such as the next‑generation PlayStation 6. The design uses multiple heat pipes with a sintered wick layer and a sealed working fluid—likely water—that vaporizes at hot spots and condenses elsewhere, providing consistent heat removal whether the console is placed horizontally or vertically. This approach aims to eliminate the liquid‑metal leaks and overheating problems that plagued early PS5 units, especially when the console was positioned upright. The patent describes larger fins and a geometry that mitigates gravity‑induced pooling, offering more reliable thermal performance and lower manufacturing costs. Sony has not confirmed that the technology will appear in the PS6, but analysts view the filing as a strong indication that the company intends to move away from the controversial liquid‑metal solution used in the PS5.