Sony's PlayStation 6 to Use New Vapor‑Based Cooling, Patent Shows

Sony Interactive Entertainment has filed a patent that outlines a revised cooling system for the upcoming PlayStation 6. The design replaces the liquid‑metal solution used in the PlayStation 5 with a vapor‑chamber and heat‑pipe arrangement that can operate effectively whether the console is placed vertically or horizontally. The patent describes conical heat pipes and an internal liquid‑redistribution mechanism intended to prevent the overheating and component‑leak issues reported by PS5 owners.

While the patent does not confirm a launch date or price, industry observers have speculated a 2027‑2028 release window with a price near $1,000. Sony has not officially validated these details, but the filing suggests the company is addressing the thermal challenges that have plagued its previous generation.

The new cooling approach aims to simplify manufacturing, reduce risk of liquid‑metal spills, and improve reliability for the next‑generation console.