South Korean tech firms to showcase AI semiconductor solutions at SEMICON Taiwan 2026

South Korean companies Okins Electronics and LG Chem have announced their participation in SEMICON Taiwan 2026, scheduled for September 2–4 at the Nangang Exhibition Center in Taipei. The event is expected to be the largest in the exhibition's history, featuring over 1,300 companies from 65 countries.

Okins Electronics will showcase its core semiconductor testing components, including its self-developed burn-in sockets, test sockets, and ultra-precision connectors. The company aims to highlight high-value test solutions designed for high-temperature and high-voltage environments, catering to the increasing complexity of AI and high-performance computing (HPC) packaging. Okins plans to leverage its newly established Taiwan branch to expand its presence in the AI and non-memory semiconductor markets.

LG Chem will present advanced packaging and power semiconductor materials specifically for AI applications, including High Bandwidth Memory (HBM). Their exhibition will feature solutions such as glass core solutions, build-up films, and die attachment films (DAF) in an ‘Advanced Package Zone’. Additionally, their ‘Power Package Zone’ will display thermal management and conductive sintering pastes designed to improve the efficiency and heat management of power semiconductors used in AI data centers.