STMicroelectronics launches compact intelligent power modules

STMicroelectronics has announced a new series of small low-loss intelligent moulded modules (SLLIMM) featuring direct-bonded copper (DBC) in a compact outline. Designed for industrial drives, air conditioners, heat pumps, and home appliances, these modules provide a complete 600V, 3-phase IGBT inverter bridge.

The new SLLIMM Compact series footprint measures 18.8mm x 32.8mm, making it more than 30% smaller than existing IGBT IPM in DBC packages. The initial module, the 20A STGI15C60S, is intended for low- and medium-power motor drive designs. The package utilizes topside cooling for thermal efficiency and is capable of operating in hard-switching circuit topologies up to 20kHz.

Technical features include two control ICs for driving integrated high-side and low-side IGBTs, a bootstrap diode, and protection circuitry. The module offers an isolation rating of 2000 Vrms/min and includes safety protections such as undervoltage lock-out (UVLO), smart shutdown, a temperature sensor, and a comparator for fault detection. The STGI15C60S is currently in production.