Taiwanese tech firms showcase advanced packaging and photonics at SEMICON

Major Taiwanese display and semiconductor component manufacturers are showcasing advanced packaging and photonics technologies at SEMICON.

LIG (8111-TW) is advancing its silicon photonics research in collaboration with the Industrial Technology Research Institute (ITRI). The company is focusing on high-speed silicon photonics modules, specifically targeting 1.6T optical transceivers and planning future development for 3.2T modules. LIG aims to begin small-scale deliveries in the fourth quarter of this year, with expanded shipments expected in early next year.

Innolux is introducing its Chip Last technology platform, which utilizes high-density heterogeneous integration (HIPoS) to target the AI and High-Performance Computing (HPC) advanced packaging supply chain. The company plans to move toward mass production in the second half of 2027. Meanwhile, AUO Corporation is focusing on smart manufacturing and sustainability for the semiconductor industry. Through its subsidiary, AUO is implementing AIoT and energy management solutions to address the high power, water, and carbon management demands of AI-driven semiconductor expansion.