Taiyo Holdings develops next-generation semiconductor packaging material

Taiyo Holdings Co., Ltd. and imec have announced a breakthrough in semiconductor packaging technology with the development of the FPIM Series. This next-generation, fine-pitch Redistribution Layer (RDL) material is designed for the dual damascene process.

Presented at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) in Helsinki, the research demonstrates the successful fabrication of a three-layer RDL structure on 12-inch wafers. The results achieved a target critical dimension (CD) of 700 nanometers for both interconnect lines and vias. The material also demonstrated excellent electrical characteristics, specifically regarding leakage current and resistance in the first metal layer (M1).

This development is considered a significant step toward sub-micron RDL design rules, which are essential for advancing AI semiconductor performance. Taiyo Holdings has been providing small samples of the material for research and development since 2025. The company aims to eventually achieve RDL fabrication with a CD of 500 nanometers or less.