Teradyne expands Titan HP platform with burn-in testing for AI chips

Teradyne, Inc. has expanded its Titan HP platform to include burn-in reliability testing capabilities, specifically targeting high-power AI accelerators for data centers and automotive semiconductors.

Traditionally, burn-in testing involves placing devices in dedicated ovens to maintain a constant ambient temperature before moving them to functional testing. The Titan HP platform shifts this approach by maintaining each device at its specific target junction temperature while executing realistic workloads. This method allows for more precise thermal control and stress application, which is critical for high-density AI chips where ambient air temperature does not accurately reflect the actual die temperature.

The platform utilizes an asynchronous slot architecture, allowing individual slots to be loaded, tested, or maintained independently without halting the entire system. By integrating system-level testing (SLT) and reliability testing onto a single platform, Teradyne aims to reduce capital expenditure, minimize factory floor space requirements, and shorten time-to-market. The enhanced burn-in functionality is already available and being used in production environments.