Türkiye targets semiconductor independence via domestic chip production

Türkiye has launched a strategic initiative to achieve technological independence through increased domestic semiconductor production and research. As part of the 2027-2029 Medium Term Program (OVP), the country aims to strengthen its R&D, design, and manufacturing capabilities to secure its position in the global value chain.

Key objectives include establishing chip production facilities to manufacture chips for identity cards, passports, and various industrial applications. The program seeks to advance production capabilities from the current 250 nanometer level to 110 nanometers. Efforts are being led by institutions such as TÜBİTAK BİLGEM and the Semiconductor Technologies Research Laboratory (YİTAL).

To support this transition, a National Chip Consortium is being considered, alongside potential support from the Ministry of Industry and Technology’s HIT-30 High Technology Investment Program. Action plans targeting sectors such as manufacturing, energy, agriculture, health, and transportation are expected to be finalized by the end of the year.