TRUMPF introduces laser technology for integrated AI chip cooling

At Semicon Taiwan, TRUMPF introduced a new application of ultrashort-pulse lasers designed to enable the industrial production of cooling systems integrated directly into artificial intelligence chips.

As AI processors demand higher computing power through advanced packaging and chip stacking, heat dissipation has become a critical bottleneck. Conventional cooling methods, such as cooling server racks or data centers, are increasingly insufficient for the heat generated within dense chip stacks.

TRUMPF’s laser technology allows manufacturers to cost-effectively produce the fine microstructures required for direct thermal management, such as microfluidic cooling or heat spreaders, within the chip stack itself. This process is compatible with various high-performance materials, including silicon carbide and diamond, which are used to facilitate efficient heat dissipation.