TSMC, Bosch and Infineon advance Dresden chip factory and university partnership

Taiwan Semiconductor Manufacturing Company (TSMC), the European Semiconductor Manufacturing GmbH (ESMC) and the Technical University of Dresden signed a memorandum of understanding to deepen joint research, talent development and international promotion of the Dresden semiconductor cluster. The agreement expands the existing Semiconductor Talent Incubation Program and adds new joint teaching and recruitment initiatives.

Construction of the ESMC fab, a €10 billion project involving TSMC, Bosch, Infineon and NXP, is progressing rapidly. The roof is expected to be completed by the end of 2026, followed by interior fit‑out, with the first production machine installed and the first staff moving into the site in mid‑2027. The plant will eventually host about 2,000 jobs, with many specialists recruited from Taiwan. The German federal ministry is contributing €5 billion to the project.