TSMC breaks ground on advanced packaging park in Kaohsiung

Taiwan has commenced construction on a major advanced semiconductor packaging hub at the Baipu Industrial Park in Kaohsiung. The project, which includes participation from industry leaders such as TSMC, Foxconn, and ASE, aims to strengthen the global supply chain for high-performance artificial intelligence chips.

TSMC plans to construct two facilities within the park dedicated to technology validation and talent training. This development is intended to reduce production timelines by allowing suppliers to test materials directly on-site. The initiative also seeks to distribute modern industrial capacity more broadly across Taiwan.

President Lai Ching-te attended the groundbreaking ceremony, noting that advanced packaging is a vital component of global AI competition. To support the expansion, the Kaohsiung city government will provide factory infrastructure, while the state utility Taipower has been tasked with ensuring stable electricity requirements for the region through at least 2035.