TSMC breaks ground on Chiayi Science Park Phase 2 advanced‑packaging hub

On July 12, Taiwan’s National Science and Technology Council and Chiayi County officials held a groundbreaking ceremony for the second phase of the Chiayi Science Park. The event included representatives from seven local temples, government officials, and TSMC executives, symbolising the integration of community and high‑tech development.

Phase 2 will cover about 90 hectares, with TSMC leading the construction of three additional advanced‑packaging fabs, aiming for completion by 2031. The expansion is expected to generate more than NT$3 trillion in annual output and create over 9,000 jobs, supporting the “Southern New Silicon Valley” strategy that links the park with other Taiwanese semiconductor clusters and addresses rising global demand for AI and high‑performance‑computing chips. TSMC also plans parallel advanced‑packaging facilities in Arizona, USA, slated for operation by 2029.