TSMC completes 1.6nm chip process development, targets 2026 production

TSMC has completed the development and validation of its 1.6nm chip manufacturing process, known as the A16 node. The company is expected to begin mass production of these angstrom-class chips in the fourth quarter of 2026.

The A16 process introduces the Super Power Rail (SPR) technology, which utilizes Vertical Backside Contacts to move power delivery lines to the back of the wafer. By separating power wiring from signal wiring, the architecture reduces data transmission bottlenecks and improves efficiency.

Compared to the 2nm process, the 1.6nm technology is projected to provide an 8% to 10% increase in computing speed and an 8% to 10% increase in transistor density. Most notably, it is expected to reduce power consumption by 15% to 20%. While major companies like Apple, Qualcomm, and MediaTek are preparing for 2nm launches, TSMC is reportedly targeting the 1.6nm process toward high-performance computing and AI applications rather than mainstream mobile devices in the immediate term.