TSMC expands Open Innovation Platform via imec IC-Link and M31 partnerships

TSMC is expanding its Open Innovation Platform (OIP) through new partnerships aimed at advancing semiconductor design and efficiency. imec IC-Link has joined the OIP Cloud Alliance, becoming the first provider to offer cloud-managed chip design services. This collaboration allows customers to access advanced process nodes and design capabilities through a secure cloud environment, supporting hybrid EDA workflows for applications in AI, communications, automotive, and industrial sectors.

In a separate development within the TSMC ecosystem, IP provider M31 and ultra-low-power semiconductor leader Ambiq have announced a collaboration to launch a Foundation IP solution based on the TSMC N12e process. This solution integrates optimized SPSRAM memory compilers and ultra-low leakage standard cell libraries. The technology is specifically designed to meet the power and area constraints of AIoT, wearable devices, and ‘always-on’ edge applications, helping designers reduce leakage power and accelerate time-to-market.