TSMC joint venture ESMC targets 2027 production in Dresden

The European Semiconductor Manufacturing Company (ESMC)—a joint venture between TSMC, Bosch, Infineon, and NXP—is progressing with its wafer plant construction in Dresden, Germany, with production expected to begin by the end of 2027. The facility is projected to create at least 7,000 new jobs in the northern semiconductor industrial zone.

To manage the anticipated increase in commuters and reduce traffic congestion, the city of Dresden has proposed a €54 million extension of the No. 8 tram line to the industrial area. While the city previously considered a route near GlobalFoundries, that option was sidelined due to concerns regarding ground vibrations and electromagnetic interference. The tram extension project is currently facing delays, with a city council vote expected in November and a potential two-year review process ahead.

Until the tram extension is completed, employees will rely on bus connections, specifically the 78 and 80 lines, to reach the site.