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[TECHNOLOGY] · Taiwan, United States · 6 sources

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Part of situation: AI infrastructure demand drives tech sector growth and risk (26 clusters)

TSMC to double CoWoS packaging capacity by 2028 to meet AI demand

TSMC CoWoS AI chips advanced packaging semiconductor manufacturing

TSMC is significantly expanding its advanced packaging capacity to meet surging AI chip demand. The company plans to increase its CoWoS capacity from approximately 130,000 wafers per month by the end of 2024 to 260,000 wafers per month by the end of 2028. This expansion will focus on facilities in Taiwan (AP7) and Arizona, USA.

In August, TSMC reported a 53.3 percent increase in monthly revenue, reaching approximately 16.3 billion US dollars. To support future growth, the company has secured an agreement with ASML Holding NV for advanced lithography machines and expects capital expenditures to reach between 60 billion and 64 billion dollars in 2026.

As TSMC scales, competitors are also positioning themselves. Intel is developing its EMIB-T packaging technology, which analysts estimate could reach a capacity equivalent to 40,000 to 45,000 CoWoS wafers per month by 2028. Additionally, TSMC is accelerating its 1.4nm production timeline in Taiwan, with some facilities potentially entering mass production as early as late 2025.

Apple remains a major client, with its upcoming A20 Pro chip expected to utilize TSMC’s 2-nanometer production process.

Entities

ASML Holding NV · Apple Inc · Apple Inc. · Intel · Nvidia · Nvidia Corp · TSMC · Taiwan · Taiwan Semiconductor Manufacturing Co

Claims

What the coverage asserts, and how many sources carry each claim.

  • [○ 1 SOURCE] TSMC has secured an agreement with ASML Holding NV to use advanced lithography machines. denar.mk
  • [○ 1 SOURCE] TSMC expects capital expenditures to reach between 60 billion and 64 billion dollars in 2026. denar.mk
  • [● 3 SOURCES] TSMC aims to expand CoWoS capacity to 260,000 wafers per month by the end of 2028. thegeek.hu · thegeek.games · www.peoplenews.tw
  • [○ 1 SOURCE] TSMC's August revenue reached approximately 16.3 billion US dollars. denar.mk
  • [○ 1 SOURCE] TSMC's monthly revenue grew by 53.3 percent in August. denar.mk
  • [● 3 SOURCES] Intel's EMIB-T capacity is estimated to reach 40,000 to 45,000 wafers per month in 2028. thegeek.hu · thegeek.games · www.peoplenews.tw
  • [● 3 SOURCES] TSMC's CoWoS capacity is expected to reach 130,000 wafers per month by the end of this year. thegeek.hu · thegeek.games · www.peoplenews.tw
  • [○ 1 SOURCE] Apple's A20 Pro chip utilizes TSMC's 2-nanometer production process. www.fool.com

Sources

台積電CoWoS產能2年翻倍　3大台廠受惠、最新布局一文看懂 [www.peoplenews.tw]
Két éven belül megduplázza a TSMC a CoWoS-kapacitást az MI-chiphiány miatt? [thegeek.hu]
Will TSMC Double Its CoWoS Capacity Within Two Years Due to the AI Chip Shortage? [thegeek.games]
Приходите на „TSMC“ пораснаа за 53 проценти, побарувачката за AI чипови ја надминува понудата [denar.mk]
Apple and Taiwan Semiconductor Manufacturing Just Announced a Cutting-Edge Chip. 1 Stock Offers Far Greater Upside. | The Motley Fool [www.fool.com]
台積電 1. 4nm 可望提前於 2027 年量產 - 滄者極限 [www.coolaler.com]