AI infrastructure shifts focus toward power supply and advanced packaging

AI infrastructure data center power demand semiconductor packaging liquid cooling AI computing

The rapid expansion of artificial intelligence is driving a fundamental shift in global technology infrastructure, moving the primary bottleneck from chip availability to power supply and advanced packaging. TrendForce reports that AI server electricity demand in data centers is projected to rise from 25% in 2025 to over 40% by 2027, potentially creating a massive supply-demand gap in grid capacity by 2030.

To address these challenges, companies are innovating across the hardware stack. Huawei unveiled its Source-Network-Load-Storage AIDC solution at the Huawei Connect 2026 conference, introducing products like the Taishan MW-class UPS and AI-enabled liquid cooling systems to manage high-density power and heat. In the semiconductor sector, TSMC is expected to maintain its dominance in AI chip packaging through its CoWoS-L technology until at least 2028, despite competition from Intel's EMIB solutions.

Additionally, the industry is seeing advancements in thermal management and connectivity. Experts note that as AI chips increase in power, solutions such as diamond composite materials for cooling and 800V high-voltage direct current (HVDC) for power delivery are becoming essential. Meanwhile, AIC is expanding its partnership with AMD to provide diverse server motherboards for next-generation AI infrastructure.

Entities

AMD · Huawei · Intel · Nvidia · TSMC · TrendForce

Claims

What the coverage asserts, and how many sources carry each claim.

[○ 1 SOURCE] The gap between data center electricity demand and grid supply could reach 268 GW by 2030. www.ithome.com
[○ 1 SOURCE] AIC will showcase AMD-based server motherboards at the AMD Embedded Summit Taipei 2026. technews.tw
[○ 1 SOURCE] TSMC's CoWoS-L packaging technology is expected to maintain market dominance until at least 2028. zdnet.co.kr
[○ 1 SOURCE] NVIDIA's high-performance GPU shipments are expected to increase by approximately 30% in 2026. zdnet.co.kr
[○ 1 SOURCE] AI server electricity demand in data centers is expected to rise from 25% in 2025 to over 40% by 2027. www.ithome.com
[● 2 SOURCES] Huawei unveiled its Source-Network-Load-Storage AIDC solution to optimize AI infrastructure. www.ltvnews.net · www.thehubnews.net
[○ 1 SOURCE] Kunlun Technology received the Huawei Computing Outstanding Contribution Award at the Huawei Connect 2026 conference.
[● 2 SOURCES] Huawei released the Taishan UPS, the industry's first single-cabinet MW-class UPS. www.ltvnews.net · www.thehubnews.net