Vieworks unveils 100 Gbps COF integrated solution for semiconductor inspection

Vieworks, a medical and industrial imaging solution company, has unveiled its ‘COF integrated solution’ to target the High Bandwidth Memory (HBM) and AI semiconductor inspection markets. The company debuted the technology at the VISION 2026 exhibition in Stuttgart, Germany.

The CoaXPress-over-Fiber (COF) solution utilizes optical fibers to transmit large volumes of image data at speeds of 100 Gbps per channel. It supports data transmission distances of up to 10 km, making it suitable for large-scale production lines and high-speed inspection processes where long-distance data transfer is required.

Unlike previous offerings that focused on standalone COF cameras, this new integrated approach combines cameras, dedicated cables, and frame grabbers into a single package. This strategy aims to reduce the burden on customers to source and configure individual components for their inspection systems.

In addition to the COF solution, Vieworks showcased 25 types of industrial cameras and six imaging solutions, including technologies utilizing ultraviolet (UV), near-infrared (NIR), and short-wave infrared (SWIR) wavelengths. These capabilities allow for the detection of microscopic defects and material characteristics that are difficult to identify with visible light, particularly in semiconductor wafer and electronic component inspections.