Vivo X500 Pro to feature 2nm MediaTek SoC and advanced Sony sensor

Vivo has revealed technical specifications for its upcoming flagship X500 Pro and X500 Pro Max smartphones. The devices will be powered by a MediaTek Dimensity SoC manufactured using TSMC’s 2-nanometer N2P process. This new chip is expected to feature a redesigned GPU architecture and a high-performance NPU, potentially serving as a competitor to Qualcomm’s Snapdragon 8 Elite series.

In addition to processing power, the X500 Pro will feature advanced imaging capabilities. The telephoto camera will utilize a Sony LYTIA 610 sensor with a unique hybrid pixel structure. This layout combines a 1x1 arrangement for green pixels to maximize detail with a 2x2 grouping for red and blue pixels to enhance phase-detection autofocus.

Vivo also claims the telephoto module will offer CIPA 7.0-rated image stabilization, significantly higher than many current flagship competitors. Video features are expected to include 4K recording at 120 FPS in 10-bit Log format, AI-driven highlight generation, and hardware-based video resolution enhancement. Further details are anticipated in September.