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Xiaomi unveils Xring chip series and CXMT LPDDR6 memory
Xiaomi has unveiled a new suite of in-house semiconductors, headlined by the Xring O3 mobile processor. Manufactured on TSMC's 3nm N3P process, the Xring O3 is designed for the upcoming Xiaomi 18 Fold foldable smartphone. The chip features a 10-core CPU architecture and a 16-core GPU, achieving a record-breaking AnTuTu score of over 5.22 million. It is also the first mobile SoC to support LPDDR6 memory, provided by Chinese manufacturer CXMT.
CXMT has announced the mass production of its LPDDR6 memory chips, marking a significant milestone for the Chinese semiconductor industry. These chips, which offer peak speeds of up to 12,800 Mbps, will be integrated into the Xiaomi 18 Fold. This collaboration positions CXMT as a serious competitor to established global memory leaders like Samsung and SK Hynix.
In addition to mobile processors, Xiaomi introduced the Xring D100, a 3nm chip specifically designed for intelligent driving in electric vehicles. The D100 features a 20-core CPU and a 16-core NPU, aiming to handle high-performance AI tasks for autonomous driving. The company also announced the Xring O100, a 6nm chip optimized for AI applications, as part of its broader strategy to increase vertical integration and reduce reliance on external chip suppliers.
Entities
Arm · CXMT · Lei Jun · SK Hynix · Samsung Electronics · TSMC · Xiaomi · Xiaomi 18 Fold · Xring O3
Claims
What the coverage asserts, and how many sources carry each claim.
- [● 3 SOURCES] Xiaomi introduced the Xring O100 chip for AI optimization. android-mt.ouest-france.fr · kienthuc.net.vn · www.xataka.com
- [● 3 SOURCES] The Xring O3 is the first mobile processor to support CXMT's LPDDR6 memory. phone.cnmo.com · www.drweb.de · www.computerbase.de
- [● 2 SOURCES] The Xring D100 is built on a 3nm process. www.motorimagazine.it · www.liputan6.com
- [● 3 SOURCES] Xiaomi introduced the Xring D100 chip for intelligent driving. www.motorimagazine.it · www.liputan6.com · kienthuc.net.vn
- [● 5 SOURCES] The Xring O3 is manufactured using TSMC's 3nm N3P process. congnghevadoisong.vn · android-mt.ouest-france.fr · phone.cnmo.com · www.it-boltwise.de · pisapapeles.net
- [● 4 SOURCES] CXMT has achieved mass production of LPDDR6 memory chips. phone.cnmo.com · sputniknews.cn · www.drweb.de · www.computerbase.de
- [● 3 SOURCES] The Xring O3 achieved a score of 5.22 million on AnTuTu. www.ajudandroid.com.br · phone.cnmo.com · kienthuc.net.vn
- [● 7 SOURCES] Xiaomi announced the Xring O3 chip, which will debut in the Xiaomi 18 Fold. congnghevadoisong.vn · www.ajudandroid.com.br · android-mt.ouest-france.fr · phone.cnmo.com · www.it-boltwise.de · +2 more