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Xiaomi unveils XRING O3 3nm chip for upcoming foldable devices
Xiaomi has officially unveiled its second-generation in-house mobile processor, the XRING O3, marking a strategic move to reduce reliance on external suppliers like Qualcomm and MediaTek. Manufactured using TSMC’s 3-nanometer N3P process, the chip features a 10-core CPU architecture and is the first mobile SoC to support LPDDR6 memory, offering a bandwidth of 113.8 GB/s.
The XRING O3 has achieved significant performance benchmarks, including an AnTuTu v11 score exceeding 5.22 million points. It is equipped with a G2-Ultra NX GPU, which reportedly provides 85% better graphics performance with 64% lower power consumption compared to its predecessor. The chip is expected to debut in the upcoming Xiaomi 18 Fold, a new wide-design foldable smartphone, and the Xiaomi Pad 9 Pro Max tablet, both slated for a September launch.
Additionally, Chinese memory manufacturer CXMT is identified as a prospective supplier of LPDDR6 memory for the XRING O3. This development highlights a growing trend of major smartphone manufacturers pursuing vertical integration of critical hardware components to enhance performance and supply chain control.
Entities
Apple · CXMT · LPDDR6 · Lei Jun · MediaTek · Qualcomm · SK Hynix · TSMC · Xiaomi · Xring O3
Claims
What the coverage asserts, and how many sources carry each claim.
- [● 3 SOURCES] CXMT is a prospective LPDDR6 supplier for the XRING O3. meeco.kr · biz.heraldcorp.com · www.koreaherald.com
- [● 9 SOURCES] The XRING O3 is the first mobile SoC to support LPDDR6 memory. trend.dk · www.techbang.com · www.ibtimes.com.au · www.donanimhaber.com · www.koreaherald.com · +4 more
- [● 11 SOURCES] The chip achieved an AnTuTu v11 benchmark score exceeding 5.22 million points. trend.dk · www.techbang.com · www.donanimhaber.com · www.ibtimes.com.au · www.tamindir.com · +6 more
- [● 13 SOURCES] The XRING O3 is manufactured using TSMC’s 3-nanometer N3P process. trend.dk · www.techbang.com · genk.vn · www.tecnoandroid.it · www.ibtimes.com.au · +8 more
- [● 8 SOURCES] Xiaomi unveiled the XRING O3 mobile processor on August 24. trend.dk · www.techbang.com · genk.vn · www.tecnoandroid.it · www.ibtimes.com.au · +3 more
- [● 10 SOURCES] The XRING O3 will power the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max. trend.dk · www.techbang.com · www.donanimhaber.com · www.ibtimes.com.au · www.intomobile.com · +5 more
- [● 13 SOURCES] The XRING O3 features a 10-core CPU architecture. trend.dk · www.donanimhaber.com · www.tecnoandroid.it · www.ibtimes.com.au · shiftdelete.net · +8 more
- [● 6 SOURCES] Xiaomi aims to reduce dependence on Qualcomm and MediaTek through in-house chip development. trend.dk · genk.vn · www.tecnoandroid.it · www.transmedia.cl · cafebiz.vn · +1 more