Xiaomi unveils XRING O3 3nm SoC for flagship devices

Xiaomi has introduced its XRING O3 (Xuanjie O3) mobile SoC, a 3nm process chip designed to enhance its hardware ecosystem. The chip features a 10-core CPU architecture and a 16-core GPU, aiming for significant performance gains over its predecessor, the XRING O1.

Technical specifications for the XRING O3 include a peak CPU frequency of 4.35GHz and an NPU optimized for large language models (LLMs), specifically designed to work with Xiaomi’s proprietary MiMo model. The chip supports LPDDR6 memory and UFS 4.1 storage. Performance benchmarks indicate an AnTuTu score exceeding 5 million.

The XRING O3 is set to debut in the Xiaomi 18 Fold and the Xiaomi Pad 9 Pro Max. Additionally, reports suggest Xiaomi may expand the use of this self-developed chip to mainstream slab-style smartphones by 2027.