[PERSON]
Wu Tian‑yu
Featured in 1 tracked story · first seen
Situations
Taiwan AI chip packaging expansion
2 clusters · 7 sources · last updated
Latest: TSMC expands CoWoS outsourcing to meet AI chip demand
In late July, ASE Technology Holding highlighted a looming AI‑hardware bottleneck and unveiled a US$10.5 billion capital‑expenditure plan to build new facilities and expand existing sites. The company aims to accelerate