[REVISION HISTORY]

ASML: AI demand, regional shifts, and technological roadmaps

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2026-10-12 15:31 UTC → 2026-10-26 06:53 UTC · added ~~removed~~

ASML continues to lead the semiconductor lithography market, driven by AI-related chip demand. The company is prioritizing its Laser-Produced Plasma (LPP) technology, aiming to increase power from 500W to 1,000W. In a major manufacturing milestone, Intel and ASML have successfully processed over one million wafers using High-NA EUV lithography systems. Despite global demand, ASML faces a severe lack of customers within Europe. In 2026, the company reported zero sales of new lithography machines to European manufacturers, a trend Frank Heemskerk, Executive Vice President of Public Affairs, attributed to insufficient investment in new semiconductor fabrication plants on the continent. While the United States, China, and India aggressively incentivize manufacturing, ASML’s most advanced machinery is primarily sold to Asia and North America. Regulatory tensions are intensifying due to U.S. legislative efforts. House China Committee Chairman John Moolenaar is pushing for the MATCH Act, which seeks to restrict not only the sale of equipment to Chinese entities like SMIC and Huawei but also the maintenance, service, and technical support for existing machinery. ASML CEO Christophe Fouquet has warned that excessive export controls could create “desperation,” potentially accelerating China's drive to develop independent technological capabilities. CFO Roger Dassen added that such legislation could be counterproductive by accelerating China's domestic technology development. In the South Korean market, ASML has finalized a 10% price increase for replacement parts for both EUV and DUV lithography machines, effective January ~~2025. This hike follows~~ 2025, following negotiations with ~~major clients~~ Samsung Electronics and SK hynix. Looking ahead, ASML and Carl Zeiss have proposed a technical roadmap for “Hyper NA” EUV technology, aiming to increase the numerical aperture from 0.55 to at least 0.75 to enable 5-nanometer feature printing. ~~While this technology is in the R&D phase and may not be commercially ready until approximately 2036, ASML is currently scaling capacity to meet rising AI demand.~~

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