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India-Taiwan-Japan semiconductor and AI cooperation

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2026-09-01 03:17 UTC → 2026-09-01 16:42 UTC · added ~~removed~~

The semiconductor and artificial intelligence sectors are seeing increased international cooperation and investment. In India, efforts to build a complete semiconductor value chain include the upcoming SEMICON India 2026, supported by the India Semiconductor Mission and significant approved investments exceeding Rs. 1.64 lakh crore. Simultaneously, Taiwan is focusing on AI-driven smart manufacturing and advanced packaging. SEMICON Taiwan 2026, themed ‘Transform Tomorrow’, is scheduled for September 2–4 at the Nangang Exhibition Center in Taipei. The event is expected to attract over 100,000 participants and will focus on critical trends such as AI computing power, heterogeneous integration, and quantum technology. Industry leaders have emphasized Taiwan’s central role in the global ecosystem. Wu Tian-yu, CEO of ASE Group, noted that while the industry faces domestic challenges regarding talent, land, and power resources, Taiwan remains a vital hub for the global AI supply chain. Major companies are set to showcase specialized technologies at the exhibition, including Rigaku’s X-ray metrology for HBM and 2.5D/3D packaging, and MacDermid Alpha Electronics Solutions’ materials designed for AI and high-performance computing architectures. Furthering these technological ties, India and Japan are working to deepen partnerships in semiconductors and AI, with Indian officials engaging Japanese companies to encourage long-term capital investment in India’s manufacturing ecosystems. At the 2026 Semiconductor Network Summit, President Lai Ching-te emphasized Taiwan's role as a reliable global partner, highlighting its ability to provide stable supplies through its democratic legal framework. To mitigate geopolitical and natural disaster risks, Taiwan is prioritizing a resilient, interconnected global supply chain. Key developments include TSMC’s planned entry into the Baipu Industrial Park in Kaohsiung to establish an advanced packaging equipment and material supply chain, with development set to begin in September. Additionally, Micron Technology reaffirmed its commitment to Taiwan as a critical base for high-bandwidth memory production.

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